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The third annual Qualcomm Snapdragon Technology Summit was held on Maui, Hawaii, on 4–6 December 2018. This event featured several industry milestones related to 5G mobile communication systems and the Snapdragon mobile platforms.
During the second day of the technology summit, Qualcomm Technologies unveiled the Snapdragon 855 chipset, the company’s newest generation in the Snapdragon 8 Series Mobile Platform. This is the world’s first commercial mobile platform supporting, collectively, multigigabit 5G, industry-leading artificial intelligence (AI) and immersive extended reality, ushering in a new decade of revolutionary mobile devices.
 Using new chip architectures built on leading 7-nm process technology, the Snapdragon 855 will offer users long-lasting battery life and enhanced experiences in such areas as imaging, audio, gaming, and extended reality.
The Snapdragon 855 is the first mobile platform to support the new Qualcomm 3D Sonic Sensor, the world’s first commercial ultrasonic fingerprint solution supported under the display. This is the only mobile solution that can accurately detect fingerprints through numerous contaminants. Furthermore, this technology enables sleek, cutting-edge form factors while distinguishing itself from alternatives with higher levels of security and accuracy.
The Snapdragon 855 Mobile Platform is currently sampling to customers and is expected to begin shipping in commercial devices in 2019. The Snapdragon 855 chipset will power the next generation of premium flagship devices and launch a new decade of more immersive and connected user experiences.
Full article: IEEE Vehicular Technology Magazine, Volume 14, Number 2, June 2019 | 
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